2023 szeptember 14-én a Kaliforniai Egyetem professzora, Albert Wang előadást tart a tanszékünkön a rádiófrekvenciás integrált áramkörök chipen megvalósított ESD védelmeiről, ezek kihívásairól illetve jövőjéről.
Az előadás 09.14-én 09-11 óra között, a V1 épület 501-es termében tekinthető meg.
Cím: ESD-RFIC Co-Designs
Előadó: Prof. Albert Wang, Dept. of ECE, University of California, Riverside, CA 92521, USA, aw@ece.ucr.edu
Helyszín: V1.501-es előadó
Időpont: 2023. szeptember 14-én 9:00-11:00
Szervező: BME-HVT és ED/AP/MTT/EMC/COM Hungary Chapter
ABSTRACT
ESD failure is one of the most devastating IC reliability problems. Recent advances in IC technologies and designs, e.g., FDSOI, sub-14nm CMOS, FinFET, GAA, 3D heterogeneous integration, chiplet-based SoW, 5G wireless, U/WBG power electronics and biomedical electronics, make on-chip ESD protection design challenging. This talk discusses ESD protection designs for RF ICs with a focus on ESD-RFIC-co-designs. Starting with the ESD protection fundamentals, extremely challenges and design methods for RF ESD protection co-designs will be discussed in details, using practical design examples. Future on-chip ESD protection perspectives will be highlighted.
BIOGRAPHY
Albert Wang received the BS degree from Tsinghua University, China and the PhD degree from State University of New York at Buffalo, USA. He is a Professor of Electrical and Computer Engineering at University of California, Riverside, USA. He was a Si Valley IC designer before joining the academia. His research covers semiconductor devices, AMX/RF ICs, design-for-reliability for ICs, 3D heterogeneous integration, emerging devices and circuits, and LED visible light communications. He published two books and 310+ peer-reviewed papers, and holds sixteen U.S. patents. His editorial board services include IEEE Transactions on Circuits and Systems I, IEEE Electron Device Letters, IEEE Transactions on Circuits and Systems II, IEEE Transactions on Electron Devices, IEEE Journal of Solid-State Circuits, IEEE Journal of the Electron Devices Society and IEEE Transactions on Device and Materials Reliability. He has been IEEE Distinguished Lecturer for IEEE Electron Devices Society, IEEE Circuits and Systems Society and IEEE Solid-State Circuits Society. He was President of IEEE Electron Devices Society. He was Chair for the IEEE CAS Analog Signal Processing Technical Committee. His other committee services include the International Technology Roadmap for Semiconductor (ITRS) Committee, IEEE Heterogeneous Integration Roadmap (HIR) Committee, IEEE 5G Initiatives Committee, IEEE Smart Lighting Project Roadmap Committee, IEEE Fellow Committee and IEEE Internet of Things (IoT) Technical Community Steering Committee. He was General Chair of IEEE Electron Devices Technology and Manufacturing (EDTM) Conference and IEEE Radio-Frequency Integrated Circuits (RFIC) Symposium. He served as a Program Director of the National Science Foundation, USA. He was recipient of IEEE J. J. Ebers Award. Wang is a Fellow of National Academy of Inventors, an IEEE Fellow and an AAAS Fellow.
